Applied Angstrom Technology is a deep-tech semiconductor equipment company, built from scratch for atomic-level precision in the Angstrom Era.
Applied Angstrom Technology (AAT) is a deep-tech semiconductor equipment company that has built the first atomic layer etch platform designed AI-native from the ground up.
We were founded on a straightforward conviction: the semiconductor industry's transition to sub-3nm logic nodes, 3D memory architectures, and silicon photonics requires a fundamentally different hardware and software architecture to etch precision — one that conventional tools were never built to deliver.
AAT was engineered from a clean sheet to deliver atomic-scale precision in the angstrom era. Every architectural decision — from the decoupled chamber design to the AI process control layer — was made with one uncompromising mandate: atomic-scale precision and production-worthy throughput, built in from the first line on the drawing board.
To develop and deliver atomic-level precision process equipment for the world's most advanced semiconductor manufacturing.
AAT is headquartered in Singapore at the One-North innovation district, home to our R&D center, cleanroom facility, and core engineering team. Our presence extends to the United States, where we support business development and strategic partnerships with the world's leading semiconductor manufacturers.
SingaporeUnited StatesSemiconductor industry veterans across the industry:
10 years at Applied Materials and Lam Research in ALE and etch process and equipment development, plasma source engineering, and gas delivery systems. Led Intel 3D NAND process architecture and equipment selection. Deep expertise in leading-edge etch technology, chamber design, and AI-driven process control.
30+ years building and scaling semiconductor equipment businesses across logic, DRAM, and 3D NAND. Leadership roles across Applied Materials, KLA, Lam Research, and Ichor. Launched multiple products into high-volume manufacturing. MS, Stanford University.
20+ years of industrial operations leadership across Applied Materials, GlobalFoundries, STATS ChipPAC, AMS Osram, Nanofilm, and Celestica.
Principal Engineer at MIT, LightHaus Photonics. 25+ years' experience in semiconductor equipment design.
World-class coverage across all aspects of the semiconductor industry, device design, process and equipment development, fundamental research and materials science.
25+ years in the semiconductor industry. VP-level roles at Intel, a decade at Micron, and involvement in ASML's EUV lithography development team. Deep expertise in transitioning advanced process tools from development to high-volume manufacturing.
VP Corporate Strategy at Synopsys. 20+ years across Cadence, Arm, Qualcomm, and Lattice Semiconductor. MBA, Wharton School. Drives M&A strategy and ecosystem partnerships across the semiconductor design and manufacturing stack.
30+ years spanning process engineering and BD with deep expertise in ALD/ALE, etch/clean technologies, and Asia operations.
Ph.D. Applied Physics, Eindhoven University of Technology. 20+ years of ALD and ALE research. Founder of the ALD Academy. Recipient of the AVS Peter Mark Award and the ALD Innovation Award (2019). Acknowledged in AAT's SPIE 2026 paper for contributions to ALE process design and validation.
Ph.D., University of Warwick. Emeritus Deputy President, National University of Singapore. Founding Chairman, Intellectual Property Office of Singapore (IPOS). 50+ years of research. Recipient of the National Science & Technology Medal (2000).
Talk to our team about process development, equipment demonstration, or partnership opportunities.